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论文类型：期刊论文

发表时间：2012-11-15

发表刊物：MATERIALS LETTERS

收录刊物：SCIE、EI、Scopus

卷号：87

页面范围：43-46

ISSN号：0167-577X

关键字：Superhydrophobic; Cu surface; Aluminum substrate; Microstructure

摘要：This work presents a facile chemical deposition process to fabricate superhydrophobic Cu surfaces on Al substrates. The Al plates were first immersed in an aqueous solution that contains 1 mol/L CuSO4 and 2 mol/L NaCl for 8 s and were then modified by using fluoroalkylsilane to lower the surface energy. The sample surfaces were investigated using scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray diffraction, Fourier transform infrared spectrometry, and optical contact angle measurements. The as-prepared superhydrophobic Cu surfaces show hierarchical micro/nanometer-cale rough structures comprising pores, pore walls, dendrites, leaves, and particles with a contact angle of 162.7 degrees and a sliding angle of 0.5 degrees. (C) 2012 Elsevier B.V. All rights reserved.