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Indexed by:Journal Article
Date of Publication:2004-12-10
Journal:高等学校化学学报
Included Journals:CSCD、ISTIC、PKU、SCIE
Volume:25
Issue:12
Page Number:2224-2226
ISSN:0251-0790
Key Words:微孔硫化物;晶体结构;空旷骨架;热稳定性;半导体
Abstract:微孔化合物是一类重要的材料,广泛地应用于催化、吸附及分离等领域.目前已知的微孔材料绝大多数为无机氧化物或氟氧化物[1,2].