Indexed by:期刊论文

Date of Publication:2019-10-01

Journal:TRIBOLOGY INTERNATIONAL

Included Journals:SCIE、EI

Volume:138

Page Number:307-315

ISSN No.:0301-679X

Key Words:CMP; Pad asperity; Material removal rate; Chemical-mechanical synergy

Abstract:The performance of chemical mechanical polishing (CMP) has been found highly dependent on the pad-work-piece contact status, which is far from theoretical understanding. To this end, a physically-based material removal rate (MRR) model is developed under pad-asperity scale. The theoretical predictions agree well with the experimental results no matter the contact spots distribution is dispersed or concentrated. It is found that the deterioration of MRR is attributed to the continuously reduced number of reacted atoms in each individual contact spot and the inadequate time for chemical reaction between successive contact spots. The present model is expected to facilitate the clarification of the effect of contact status on MRR, and further provide a strategy for CMP mechanisms investigation.