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Title : 高性能制造研究所副所长机械学院招生宣传组成员（武汉）
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Alma Mater:清华大学
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School/Department:机械工程学院
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Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)

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Indexed by:Journal Papers

Date of Publication:2019-03-29

Journal:Precision Engineering

Included Journals:SCI

Volume:2019, 55

Page Number:70-76

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