大连理工大学主页平台管理系统 yanying--Home-- Analytical analysis of the grain depth-of-cut in the ultrafine rotational grinding of silicon wafer

闫英

Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates

Title : 高性能制造研究所副所长机械学院招生宣传组成员（武汉）
Gender:Female
Alma Mater:清华大学
Degree:Doctoral Degree
School/Department:机械工程学院
Discipline:Mechanical Manufacture and Automation
Business Address:大连理工大学机械学院知方楼5005
Contact Information:yanying@dlut.edu.cn
E-Mail:yanying@dlut.edu.cn

MOBILE Version

Click: times

Open time:..

The Last Update Time:..

Current position: Home >> Scientific Research >> Paper Publications

Analytical analysis of the grain depth-of-cut in the ultrafine rotational grinding of silicon wafer

Hits : Praise

Indexed by:Journal Papers

Date of Publication:2019-03-29

Journal:Journal of Manufacturing Science and Engineering

Included Journals:SCI

Volume:2018,140

Page Number:121001-10

Pre One:Direct 3D Printing of Reactive Agitating Impellers for the Convenient Treatment of Various Pollutants in Water

Next One:Effect of substrate curvature on thickness distribution of polydimethylsiloxane thin film in spin coating process

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024