Release Time:2026-03-13 Hits:
First Author: 张伟
Disigner of the Invention: 王英敏,Yanhui LI,马殿国
Institution: 材料科学与工程学院
Application Date: 2017-11-08
Application Number: US 10714244 B2
Authorization Date: 2020-07-14
Authorization Number: US 10714244 B2
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