Hits:
First Author:Kuo Liu
Disigner of the Invention:Haibo Liu,Li Te,褚恒,Wang Yongqing,jiazhenyuan
Application Number:CN201810983909.1
Authorization Date:2018-08-28
Authorization number:CN109241601A
Pre One:一种基于贝叶斯与故障树的数控机床可靠性评价方法
Next One:一种离子推进器碳栅组件制孔方法