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论文类型：期刊论文

发表时间：2011-10-01

发表刊物：JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE

收录刊物：Scopus、SCIE、EI

卷号：8

期号：10

页面范围：2050-2057

ISSN号：1546-1955

关键字：Heterogeneous Metal Interface; Mechanical Behavior; Molecular Dynamics; Microstructure; Dislocations

摘要：Tensile deformation of a defective Cu/Al interface, which is used as a model system of heterogeneous metal interfaces, is explored using molecular dynamics simulations and compared with the mechanical behavior of copper grain boundaries. Results show that the heterogeneous bonding across the interface is a weaker link of the system during mechanical loading as compared with pure copper grain boundaries. Interfacial ductile fracture is the main mechanical failure mode accompanied by the nucleation and growth of voids near the interfacial region, which differs from the fracture mode of copper grain boundary. Evolution of the microstructures and its dependency on the external loading are examined with the interface models during the deformation process. In some cases of a defective interface, the nucleation of partial dislocation loops is observed and analyzed.