Hits:
First Author:Jian Xigao
Disigner of the Invention:胡方圆,Wang Jinyan,Liu Cheng,zhangshouhai
Application Number:CN201610574633.2
Authorization Date:2016-07-19
Authorization number:CN106188539A
Pre One:用于制备超级电容器电极的多孔聚合物材料及其制备方法
Next One:一种高韧性、低粘度的苯并噁嗪/二烯丙基二酚/双马来酰亚胺共混树脂及其制备方法