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论文类型：期刊论文

发表时间：2017-10-13

发表刊物：NANOTECHNOLOGY

收录刊物：Scopus、SCIE、EI、PubMed

卷号：28

期号：41

页面范围：415705

ISSN号：0957-4484

关键字：nanoscale multilayered metallic material; nanoscale twin; cube-on-cube hetero interface; hetero-twin interface; strength; molecular dynamics simulation

摘要：Based on molecular dynamics simulations, tensile mechanical properties and plastic deformation mechanisms of nano-twinned Cu//Ag multilayered materials are investigated in this work. Simulation results show that, due to the stronger strengthening effect of the twin boundary than both the cube-on-cube and hetero-twin interfaces between Cu and Ag layers, the strength increases with the increase of layer thickness for nano-twinned Cu//Ag multilayered materials with a constant twin spacing, while it decreases with the increase of layer thickness for twin-free ones. The strength of hetero-twin multilayered materials is higher than that of the cube-on-cube samples due to the different hetero interfacial configurations. The confined layer slip of dislocation is found to be the dominant plastic deformation mechanism for twin-free hetero-twin multilayered materials and the strength versus twin spacing in nano-twinned samples follows the conventional Hall-Petch relationship. These findings will shed light on the understanding of the plastic deformation mechanisms and the fabrication of high strength nano-twinned multilayered metallic materials.