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论文类型：期刊论文

发表时间：2014-02-07

发表刊物：PHYSICS LETTERS A

收录刊物：SCIE、Scopus

卷号：378

期号：9

页面范围：736-740

ISSN号：0375-9601

关键字：Nanotwinned copper; Crack; Plastic deformation mechanism; Molecular dynamics simulation

摘要：The plastic deformation of bulk nanotwinned copper with embedded cracks under tension has been explored by using molecular dynamics simulations. Simulation results show that the cracks mainly act as dislocation sources during the plastic deformation and occasionally as sinks at later stage. The dislocation pile-up, accumulation and transformation at twin boundaries (TBs) control the plastic hardening and softening deformations. The TB dislocation pile-up zone is estimated to be 5.6-8 nm, which agrees well with previous experimental and simulation results. Furthermore, it is found that the flow stress vs. dislocation density at the hardening stage follows the Taylor-type relationship. (C) 2014 Elsevier B.V. All rights reserved.