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论文类型：期刊论文

发表时间：2009-07-07

发表刊物：JOURNAL OF PHYSICS D-APPLIED PHYSICS

收录刊物：SCIE、EI、Scopus

卷号：42

期号：13

ISSN号：0022-3727

摘要：The length, loading rate and thermal effects on the torsional response of hollow copper nanowires are investigated with molecular dynamics simulation. Evolution of atomic configuration is studied, which shows that partial dislocations nucleated from the surfaces accommodate the plastic deformation of the nanowires under torsion. With the increase in torsional angle, necking appears and the corresponding cross-section transforms from a hollow square to a solid circle. Meanwhile, atomic rearrangement from being amorphous to fcc occurs, which becomes more obvious at higher loading rates. To understand the relation between material and geometrical instabilities, the torsional buckling mode is also investigated and found to strongly depend on both wire length and temperature.