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论文类型：期刊论文

发表时间：2009-01-26

发表刊物：PHYSICS LETTERS A

收录刊物：SCIE

卷号：373

期号：5

页面范围：570-574

ISSN号：0375-9601

关键字：Nanocrystalline copper; Molecular dynamics simulation; Plastic deformation; Dislocation; Grain growth

摘要：The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations. (c) 2008 Elsevier B.V. All rights reserved.