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论文类型： 期刊论文

发表时间： 2012-09-25

发表刊物： Advanced Materials Research

收录刊物： EI、CPCI-S、Scopus

卷号： 565

页面范围： 609-614

ISSN号： 9783037854679

关键字： Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring

摘要： This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.