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发表时间：2019-03-11

论文类型：期刊论文

发表时间：2012-09-25

发表刊物：Advanced Materials Research

收录刊物：EI、CPCI-S、Scopus

文献类型：J

卷号：565

页面范围：609-614

ISSN号：9783037854679

关键字：Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring

摘要：This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.