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朱祥龙
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教授   博士生导师   硕士生导师

性别: 男

毕业院校: 大连理工大学

学位: 博士

所在单位: 机械工程学院

学科: 机械制造及其自动化

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Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects

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论文类型: 期刊论文

发表时间: 2018-10-01

发表刊物: INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物: SCIE

卷号: 98

期号: 9-12

页面范围: 2257-2270

ISSN号: 0268-3768

关键字: Ultrasonic-assisted grinding; Ultrasonic-assisted scratching; Scratching force; Topography data; Energy

摘要: With its outstanding features such as low machining loads and high material removal rate, ultrasonic-assisted grinding (UAG) has been generally accepted as an effective processing technique for hard and brittle materials. To improve UAG performance, the basic mechanisms of material removal need further investigation. This study investigates the material removal ability of both ultrasonic-assisted scratching (UAS) test and conventional scratching (CS) test by analogy with the behavior of single-grain during UAG and conventional grinding (CG), in an attempt to quantitatively reveal the coupling relationship between the vibration parameters and process parameters. With the accuracy setting ensured by acoustic emission sensors, the study used a Rockwell indenter as the scratching tool in scratching tests with various cutting depths and vibration amplitudes. The scratching forces and computer-processed topographic data were analyzed from an energy aspect. Results showed that UAS had better material removal ability and lower scratching forces. The study further demonstrates the improvement that ultrasonic vibration brought to the energy input during the scratching process, which is considered the key factor to the UAS effectiveness regarding material removal.

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