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论文类型： 期刊论文

发表时间： 2022-06-30

发表刊物： 机械工程学报

所属单位： 机械工程学院

期号： 7

页面范围： 180-188

ISSN号： 0577-6686

摘要： The surface/subsurface damage is generated inevitably in grinding glass-ceramics. In this study, the surface topography, surface/subsurface damage characteristics and material removal mechanism of glass-ceramics ground by diamond wheels with different abrasive sizes of 500#, 1500#, 2000# and 5000# are investigated. The surface/subsurface damage characteristics of glass-ceramics in brittle-mode grinding and ductile-mode grinding respectively are revealed, and a high-efficiency and low-damage ultra-precision grinding process of glass-ceramics by stages using 500# diamond wheel for rough grinding and 5000# diamond wheel for fine grinding is proposed. The experiment results show that the material is removed in brittle mode when glass-ceramics are ground by 500 #and 1500# diamond wheels, in both brittle mode and ductile mode when ground by 2000# diamond wheel, and in ductile mode when ground by 5000# diamond wheel. In the brittle-mode grinding of glass-ceramics, the surface damage consists of pits, microcracks and deep scratches, and the subsurface damage takes the form of microcracks. But in the ductile mode grinding of glass-ceramics, the surface damage has only micro-scratches, and subsurface damage is the plastic flow of workpiece material closed to the ground surface.

备注： 新增回溯数据