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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：知方楼5130
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- [71]牛林.金洙吉,周中正,董志刚,朱祥龙.Study on Electrochemical Effect in Electrochemical Grinding of Tungsten Alloy[A],The 21st International Symposium on Advances in Abrasive Technology,2022
- [72]Kangnan, Fan.金洙吉,Zebei, Wang,朱祥龙.Study on electrochemical grinding[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022:793-799
- [73]朱祥龙.于力,董志刚,康仁科,高尚.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
- [74]马付建.朱祥龙,康仁科,董志刚,邹双庆.Study on the Subsurface Damages of Glass Fiber Reinforced Composites[A],The 16th International Symposium on Advances in Abrasive Technology,2022,797:691-695
- [75]Ma, F.J..朱祥龙,康仁科,董志刚,Zou, S.Q..Study on the subsurface damages of glass fiber reinforced composites[J],Advanced materials research,2022,797:691-695
- [76]Kangnan, Fan.金洙吉,Zebei, Wang,朱祥龙.Study on electrolyte selection and electrochemical grinding process of hardly machined material[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022:267-272
- [77]张自力.金洙吉,康仁科,朱祥龙,韩晓龙,慕卿.Study on High Precision Measurement of Chemical Mechanical Polishing Removal Rate of YAG Crystal[A],euspen’s 19th International Conference & Exhibition,2022:1-4
- [78]高尚.康仁科,朱祥龙,郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
- [79]高尚.Huang, Han,朱祥龙,康仁科.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
- [80]朱祥龙.康仁科,董志刚,冯刚.Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder[J],Journal of Semiconductors,2022,32(10)