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Indexed by:期刊论文

Date of Publication:2013-12-01

Journal:Guangxue Jingmi Gongcheng/Optics and Precision Engineering

Included Journals:EI、PKU、ISTIC、Scopus

Volume:21

Issue:SUPPL

Page Number:69-75

ISSN No.:1004924X

Abstract:The fabrication of micro coils based on Micro-electronic-Mechanical System (MEMS) was researchech and a SU-8 mould was prepared by the UV-LIGA process. A sulfate copper electroforming process using dye additives was studied by experiments and then it was applied in the fabrication of micropatterns. First, the seed layer fabrication was analyzed and the copper sputtering and resist lift-off process were selected to obtain the copper seed layer on a Si substrate, and a SU-8 mould was fabricated with the SU-8 photoresist UV-lithography process. Then, a simple electroforming device was put up, the additives such as honey and dye were used in the electroforming experiments to analyze technological problems and to remove the defects such as spots, black coatings, burning and dye deposition. Furthermore, the mature process of micro electroforming was achieved. Final, copper coils with the minimum linewidth of 10   m and height of 15   m were fabricated by the precise electroforming equipment. The results verify the feasibility of copper electroforming process, which means that the proposed process can meet the requirement of micropattern electroforming.