location： Current position: Home >> Scientific Research >> Paper Publications

Barrierless Cu-Ni-Mo Interconnect Films with High Thermal

Hits:

Indexed by:期刊论文

Date of Publication:2012-01-01

Journal:Journal of ELECTRONIC MATERIALS

Volume:41

Issue:12

Page Number:3447-3452

Pre One:Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation

Next One:beta-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep