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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院5138
联系方式：0411-84706059
电子邮箱：kangrk@dlut.edu.cn
Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing
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论文类型：期刊论文
发表时间：2019-08-01
发表刊物：JOURNAL OF MANUFACTURING PROCESSES
收录刊物：SCIE、EI
卷号：44
页面范围：47-54
ISSN号：1526-6125
关键字：Double-sided lapping; Chemical mechanical polishing; Flatness; Surface integrity; Residual stress
摘要：Thin copper substrates with high flatness and surface integrity are highly required in precision physical experiments. Normally, fly cutting is used to fabricate the substrates. However, the flatness is difficult to be guaranteed after disassembly due to the clamping and machining stresses which are induced on the substrates. Besides, the surface integrity is hard to be improved because of the severe subsurface deformation and high residual stress. To solve the problem, a new process chain composed by double-sided lapping and chemical mechanical polishing (CMP) is proposed to acquire both high flatness and surface integrity on thin copper substrates. In the new process chain, double-sided lapping is employed to achieve high flatness and uniform distribution of surface residual stress, while double-sided CMP is adopted to obtain the ultra-smooth surface without damage and maintain the flatness. The results show that flatness superior to 4 mu m peak-to-valley (PV), and surface roughness less than 3 nm Ra are obtained. Moreover, both surfaces are damage-free with low surface residual stresses.