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聚合物微流控芯片基片与盖片一体化注塑成型模具

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First Author:songmancang

Disigner of the Invention:连城林,庞中华,duliqun,Minjie wang,Chong Liu

Application Number:CN201110072477.7

Authorization Date:2011-03-24

Authorization number:CN102205602A

Pre One:一种提高注塑成型PMMA微流控芯片热压键合率的方法

Next One:集成厚度可控绝缘层的非接触电导检测微芯片制作方法
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