杜立群
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:女
毕业院校:东北大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化. 微机电工程. 机械电子工程
办公地点:西部校区机械学院新大楼6009房间
电子邮箱:duliqun@dlut.edu.cn
扫描关注
- [161]Song Chang, Li Yuanqi, Li Xiaojun, Li Yu, Qi Leijie, Du Liqun, Du Liqun.Residual stress measurement in a metal microdevice by micro Raman spectroscopy,Journal of Micromechanics and Microengineering,2017,27(10)
- [162]Du Liqun, Wang QJ, Du LQ.Experimental study on ultrasonic stress relief for cured SU-8 photoresist layer,Microelectronic Engineering,2010,87(12):2555–2560
- [163]Du Liqun, Zhang xiaolei, Wang Qijia.Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment,SCIENCE CHINA - TECHNOLOGICAL SCIENCES,2010,55(11):3006-3013
- [164]Zhang Xiaolei, Zhao Ming, Du Liqun, Du Liqun.Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Subst...,JOURNAL OF APPLIED POLYMER SCIENCE,2014,133(24):411081-411089
- [165]杜立群.Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro ele...[J],Journal of Micromechanics and Microengineering,2018,28(7):075017
- [166]Zhao Zhong, Shao Ligeng, Xu Zheng, Du Liqun, Du Liqun.Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu subst...[J],Ultrasonics Sonochemistry,2019,29:1-10
- [167]杜立群, 李永辉, 李成斌.超声时效技术在微模具型腔制作中的应用,光学精密工程,2012,20(6):1250-1256
- [168]Du Liqun, Zhao Ming, Yang Tong.Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process[J],MICROMACHINES,2016,7(1):1-12
- [169]Shao Ligeng, Wang Liding, Du Liqun, Du Liqun.Enhancing the adhesion strength between Cu substrate and Ni layer in microelectroforming,Materials and Manufacturing Processes,2014,29(7):795-800
- [170]Ke Zhai, Wen Zhao, Wenjun Zhao, Heqing Zhu, Weitai Wang, Liqun Du, Ke Zhai , Liqun Du.Research of megasonic electroforming equipment based on the uniformity of electroforming process,Ultrasonics Sonochemistry,2018,42:368–375
- [171]Song Chang, Yu, Leijie, Li, Yuanqi, Qi, 127. Song Chang, du Liqun , Li Xiaojun, du Liqun.Residual stress modeling and analysis for micro electroforming layer[J],Microsystem Technologies,2017,23(10):4709-4716
- [172]赵明, 杜立群.Numerical simulations and electrochemical experiments of the mass transfer of microvias electrofo...[J],Ultrasonics Sonochemistry,2018,48:424-431
- [173]Liqun DU, Toshio FUKUDA, Fumihito ARAI, Guiryong KWON, Guiryong KWON.Structure Design of Micro Touch Sensor Array[J],Sensors and Actuators A,2003,107(1):7-13
- [174] Nie Weirong, Chen Shengli, Wang Aoan, Zhao Ming, Du Liqun.Fabrication of novel MEMS inertial switch with six layers on a metal substrate,Microsystem Technologies,2015,21(9):2025-2032
- [175]Du Liqun, Liu Yaping, Zhang Benzhuang.Reducing SU-8 Hygroscopic Swelling by Ultrasonic Treatment,Nano-Micro Letters,2010,2(3):197-203
- [176]杜立群, 徐志祥, 王翱岸, 李成斌.MEMS铜线圈UV-LIGA制备工艺,光学精密工程,2013,21:69-75
- [177]Du Liqun, Zhu Heqing, Zhao Wen, Zhao Wenjun, Wang Weitai, Zhao Jian, Li Yu.A low-g MEMS inertial switch with a novel radial electrode for uniform omnidirectional sensitivit...,Sensors and Actuators, A: Physical,2018,270:214-222