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马海涛
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[1]Ma, H. R.,Dong, C.,Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Chen, J..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[2]Qiao, Y. Y.,Wu, C. M. L.,Wang, Y. P.,Ma, H. T.,Zhao, N.,Liu, C. Y..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates ...[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[3]Gao, Zhaoqing,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen,Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
[4]Zhu, Zhidan,Ma, Haoran,Shang, Shengyan,Ma, Haitao,Wang, Yunpeng,Li, Xiaogan.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interfac...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
[5]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Ma, Haitao,Wang, Yunpeng.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints r...[J],THIN SOLID FILMS,2019,669:198-207
[6]Yao, Mingjun,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,Ma, Haitao.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Ad...[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[7]Kunwar, Anil,Zhao, Ning,Huang, Mingliang,Ma, Haoran,Ma, Haitao,Sun, Junhao.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2018,230:76-76
[8]Yao, Mingjun,Ma, Haitao,Xiao, Zhiyi,Yu, Daquan,Wang, Teng,Zhao, Ning.Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatt...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[9]Zhong, Y.,Zhao, N.,Dong, W.,Wang, Y. P.,Ma, H. T..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[10]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Wang, Yunpeng,Zhao, Ning,Huang, Mingliang,Ma, Haitao.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
total225 1/23
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