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三维芯片封装互连机理及关键技术

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Leading Scientist:赵宁

Project Participants:qiaoyuanyuan,Ma Haoran,liuxiaoying

Supported by:省、市、自治区科技项目

Status:在研

Supported by:辽宁省科学技术厅

Nature of Project:纵向

Project Approval Number:2023JH2/101300181

Date of Project Approval:2023-02-24

Scheduled completion time:2024-12-31

Date of Project Initiation:2023-01-01

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