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Senior Engineer Supervisor of Master's Candidates

Paper Publications

[1]liuxiaoying, mahaitao, LUO Zhongbing, 赵艳辉, Mingliang Huang, wanglai.刘晓英；马海涛；罗忠兵；赵艳辉；黄明亮；王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2022,22(4):1169-1172
[2]liuxiaoying, mahaitao, wanglai.超细氧化物颗粒对Sn-58Bi钎料组织及性能影响[J],大连理工大学学报,2022,1:51-57
[3]杨喜锐, 周大雨, 马晓倩, 王雪霞, 徐进, 陈国清, 侯晓多, 刘晓英, 高晓霞.Synthesis of dopant-free tetragonal zirconia nano-powders with aqueous precursor and their optica...[J],Materials Research Expresss,2018,6:15041-15041
[4]Liang, Hailong, Xu, Jin, Wang, Xuexia, Liu, Xiaohua, Chu, Shichao, Xiaoying, Zhou, Dayu, DY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Elect Beams, Dalian 116024, Peoples R China..Structure and electrical properties of pure and yttrium-doped HfO2 films by chemical solution d...[J],MATERIALS & DESIGN,2017,120:376-381
[5]刘晓英, 徐佐省, 邹龙江, 于凤云, 季首华.高校实验技术人员的继续教育初探[J],实验室科学,2014,17(6):193-195,198
[6]Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763
[7]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai, XY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337
[8]刘晓英, 赵杰, 邹龙江, 季首华.材料科学基础实验课多媒体教学及网络教学平台建设[J],中国现代教育装备,2013,19:42-43
[9]Zhao, N., Liu, X. Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931
[10]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai.Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging[A],2013,400-402

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