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论文类型：会议论文

发表时间：2017-01-01

收录刊物：CPCI-S

页面范围：219-224

关键字：Crystal plasticity; Hot forming; 22MnB5; Dislocation density; Damage; Thermal activation

摘要：Here in this paper, a multiscale framework based on crystal plasticity is proposed coupling with thermal activation mechanism, as well as the continuum damage mechanism. The microscopic hardening phenomenon is revealed by a dislocation density evolution model, which is constructed according to the temperature. The physical-based exponential function of shear strain rate is posed to describe the thermal material behavior replacing the general phenomenological power-law equation. A 3D spatial distribution of stress, strain and damage is presented in the finite element method, parameters of which are previously determined by a RVE calculation and fitting test compared to the experimental data. Finally, some discussions of stress heterogeneity and texture evolution are proposed and conclusions are made.