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论文类型：期刊论文

发表时间：2013-09-01

发表刊物：JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

收录刊物：SCIE、EI

卷号：213

期号：9

页面范围：1475-1483

ISSN号：0924-0136

关键字：Hot stamping; Interfacial heat transfer coefficient; Transient heat transfer; Oxide scale; 22MnB5

摘要：An optimization-based numerical procedure was developed to determine the temperature-dependent interfacial heat transfer coefficient (IHTC). The effects of temperature, pressure and oxide scale thickness were analyzed, for oxide thickness between 9 mu m and 156 mu m and pressure from 8 MPa to 42 MPa. Oxide scales and contact pressure both show distinctive effects on IHTC in the cooling process. The average IHTC decreases about 2461 W/(m(2).C) with the increase of oxide scale thickness and increases 2620 W/(m(2).C) with the increase of pressure. Based on the two-way ANOVA, the effect of contact pressure influences the IHTC most. Their mutual interaction is negligible. The IHTC decreases when the average temperature between the blank and die surface is above 250 degrees C and increases when the latent heat release. (C) 2013 Elsevier B.V. All rights reserved.