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Paper Publications

[11]Yang, Xiuxuan, Zhang, Bi, Xie, Guoyin, Bai, Qian.Correlation of microstructure and mechanical properties of Ti2AlNb manufactured by SLM and heat t...[J],INTERMETALLICS,2022,139
[12]Qiao, Guowen, Zhang, Bi, Dilnoza, Yuvasheva, Bai, Qian.Effect of Heat Treatment on Microstructure and Residual Stress of GH3536 Superalloy Fabricated by...[J],JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,2022
[13]丁宝洋, 白倩, 刘具龙, 张璧.基于Simulink反馈方法的钛合金铣削刀具磨损预测[J],机械工程学报,2022,55(11):224-232
[14]王龙群, 张璧, 彭颖, 谢国印, baiqian, 王义博, 白倩.增减材复合制造内部缺陷的涡流检测[J],航空学报,2022,41(3):287-295
[15]冯一琦, 谢国印, 张璧, 乔国文, Shang GAO, baiqian, 白倩.激光功率与底面状态对选区激光熔化球化的影响[J],航空学报,2022,40(12):229-238
[16]baiqian, 马浩, 殷景飞.基于偏振激光共聚焦的研磨石英玻璃亚表面损伤检测[J],Guangxue Jingmi Gongcheng/Optics and Precision Engineering,2022,29(8):1795-1803
[17]李庆鹏, 张璧, 白倩, baiqian.Detection of subsurface microcracks after grinding of single crystal silicon wafer by polarized l...[J],Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering,2022,40(4):87-92
[18]刘具龙, 张璧, 白倩, 程博, baiqian.钛合金铣削刀具/工件接触区域温度预测[J],航空学报,2022,39(12):358-369
[19]Yin, Jingfei, Bai, Qian, Li, Yinnan, Zhang, Bi.Formation of subsurface cracks in silicon wafers by grinding[J],纳米技术与精密工程,2022,1(3):172-179
[20]Zhao, Linjie, Wang, Yiqi, Zhou, Ping, Bai, Qian, Yan, Ying.Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scannin...[A],OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION XI,2022,11056

total68 2/7

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