Current position: Home >> Scientific Research >> Patents

一种耐辐照BCC结构高熵合金及其制备方法

Hits:

First Author:Yiping Lu

Disigner of the Invention:guoenyu,张欢枝,litingju,WANG Tongmin,caozhiqiang,jiejinchuan,Kang Huijun,Yubo ZHANG,Chen Diffen

Application Number:2019100850013

Authorization Date:2019-01-29

Authorization number:ZL 2019100850013

Pre One:一种高强度高导电高塑性的铜合金及其制备方法

Next One:HIGH-ENTROPY HALF-HEUSLER THERMOELECTRIC MATERIAL WITH LOW LATTICE THERMAL CONDUCTIVITY AND PREPARATION METHOD THEREOF