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论文类型： 期刊论文

发表时间： 2005-05-02

发表刊物： APPLIED PHYSICS LETTERS

收录刊物： Scopus、SCIE、EI

卷号： 86

期号： 18

页面范围： 1-3

ISSN号： 0003-6951

摘要： The focus of this study is on the role of Cu content in the dissolution kinetics of Cu in high-Sn solders during the solid/liquid reaction accompanied by interfacial intermetallic compound formation. Small additions of Cu (0.7%, 1.5%) in high-Sn solders dramatically decrease the dissolution rate of Cu at low temperatures. Sn-3.5Ag, as expected, has a dissolution rate similar to that of pure Sri. The difference in dissolution rate of Cu in various molten solders is explained in terms of the solubility limit of Cu in molten solders based on the Cu-Sn phase diagram. The correlation between the metallurgical aspects of interfacial eta(Cu6Sn5) phase formation and dissolution kinetics of Cu in molten solders leads to an understanding of the mechanism that controls the dissolution rate of Cu in molten solders. (c) 2005 American Institute of Physics.