点击次数：

论文类型： 期刊论文

发表时间： 2017-11-27

发表刊物： APPLIED PHYSICS LETTERS

收录刊物： SCIE、EI

卷号： 111

期号： 22

ISSN号： 0003-6951

摘要： As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of eta-Cu6Sn5 at cold end liquid-Sn/(111) Cu interfaces has been demonstrated. The resultant eta-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60 degrees and highly preferred orientation with their < 11 (2) over bar0 > directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies. Published by AIP Publishing.