Current position: DR. LI Bao-jun Homepage >> Scientific Research >> Patents

面向3D打印的多尺度孔洞结构轻量化建模方法

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First Author:Shengfa Wang

Disigner of the Invention:胡江北,LI Baojun,Luo Zhongxuan

Application Number:CN201711170375.2

Authorization Date:2017-11-22

Authorization number:CN107885945A

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