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一种含异形孔洞的低孔隙率负泊松比结构

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First Author:Chenwenjiong

Disigner of the Invention:汪嘉兴,Shutian Liu

Application Number:CN201710339870.5

Authorization Date:2017-05-15

Authorization number:CN107016220A

Pre One:渐进均匀化预测周期性复合材料热膨胀系数的简易实现方法
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