解兆谦

基本信息Personal Information

教授

硕士生导师

主要任职:无

性别:男

毕业院校:大连理工大学

学位:博士

在职信息:在职

所在单位:工程力学系

学科:固体力学 计算力学 工程力学

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个人简介Personal Profile

解兆谦,工学博士,大连理工大学工程力学系教授。

2020/02—今          ,大连理工大学,工程力学系,教授

2019/04—2020/02,香港城市大学,生物医学工程学系,高级研究员

2014/04—2019/03,美国西北大学,土木与环境工程系,博士后,导师:Yonggang Huang 教授(美国科学、工程、艺术与科学院三院院士,中国科学院、欧洲科学院外籍院士)

2013/12—2014/03,清华大学,航空航天学院,博士后,导师:Yonggang Huang 教授

2013/04—2013/11,香港理工大学,机械工程学系,研究助理

2006/09—2013/04,大连理工大学,工程力学系系,博士(硕博连读),导师:张洪武 教授

2002/09—2006/07,大连理工大学,工程力学系,学士

研究工作主要聚焦于力学与先进材料前沿交叉领域,在可延展柔性电子的创新性力学设计及理论等方面取得了系列成果。在国际主流期刊上发表论文50余篇(6篇ESI高被引论文,含1篇热点论文),其中以第一/通讯作者在《Science》,《Nature》,《Nature Biomedical Engineering》,《Advanced Materials》,《Neuron》,《Advanced Functional Materials》,《ACS Nano》,《NPG Asia Materials》,《Journal of Applied Mechanics》等高水平期刊发表论文15篇。研究成果被《Nature》,《Science》,《Nature Biotechnology》,《Nature Biomedical Engineering》等期刊在Research Highlights,Perspectives或News & Views/Opinions专栏中焦点报道,并多次受到ScienceDaily,US news,CNN,E&T News,MIT Technology Review,EurekAlert,The Independent,IEEE Spectrum,中国日报网,新华网等国内外重要媒体及专业杂志的报道。Google Scholar引用1600余次,H因子21。2020年加入运载学部工程力学系,并入选“星海青千引进计划(A档)”。

热烈欢迎感兴趣的同学咨询、报考本人研究生!(zxie@dlut.edu.cn)

近期代表性论文(*表示通讯作者;#表示并列第一作者):

[1]. Liu Y, Zhao L, Avila R, Yiu C, Wong T, Chan Y, Yao K, Li D, Zhang Y*, Li W*, Xie Z*, Yu X*, “Epidermal electronics for respiration monitoring via thermo-sensitive measuring,” Materials Today Physics, 13: 100199, 2020.

[2]. Lee K#, Ni X#, Lee JY#, Arafa H, Pe D, Xu S, Irie M, Avila R, Lee JH, Kim DH, Chung H, Olabisi O, Getaneh S, Chung E, Hill M, Bell J, Jang H, Liu C, Park JB, Kim J, Kim SB, Mehta S, Pharr M, Tzavelis A, Reeder JT, Huang I, Deng Y, Xie Z*, Davies CR*, Huang Y*, Rogers JA*, “Mechano-acoustic sensing of physiological processes and body motions via a soft wireless device placed at the suprasternal notch,” Nature Biomedical Engineering, 4: 148-158, 2020. (Cover feature article)

[3]. Xie Z, Avila R, Huang Y, and Rogers JA*, “Flexible and stretchable antennas for bio-integrated electronics,” Advanced Materials, 32(15): 1902767, 2020.

[4]. Yu X#, Xie Z#, Yu Y#, Lee J#, Ruban J, Ning X, Akhtar A, Ji Bowen, Sun R, Cao J, Huo Q, Zhong Y, Lee C, Kim S, Zhang C, Xue Y, Chempakasseril A, Tian P, Lu W, Jeong J, Yu Y, Comman J, Tan C, Kim B, Lee K, Feng Xue, Huang Y*, Rogers JA*, “Skin-integrated wireless haptic interfaces for virtual and augmented reality,” Nature, 575(7783): 473-479, 2019.

[5]. Chung H#, Kim B#, Lee J#, Lee J#, Xie Z#, Ibler E, Lee K, Banks A, Jeong J, Kim J, Ogle C, Grande D, Yu Y, Jang, Assem P, Ryu D, Kwak J, Namkoong M, Park J, Lee Y, Kim D, Ryu A, Jeong J, You K, Ji B, Liu Z, Huo Q, Feng X, Deng Y, Xu Y, Jang K, Kim J, Zhang Y, Ghaffari R, Rand C, Schau M, Hamvas A, Weese-Mayer D, Huang Y, Lee S, Lee C, Shanbhag N, Paller A*, Xu S*, and Rogers JA*, “Binodal, wireless epidermal electronics systems with in-sensor analytics for neonatal intensive care,” Science, 363(6430): eaau0780, 2019.

[6]. Guo Q#, Koo J#, Xie Z#, Avila R, Yu X, Ning X, Zhang H, Liang X, Song A, Huang Y, Mei Y, and Rogers JA*, “A bioresorbable magnetically coupled system for low-frequency wireless power transfer,” Advanced Functional Materials, 29(46): 1905451, 2019.

[7]. Liu Y#, Zhao L#, Wang L#, Zheng H, Li D, Avila R, Lai K, Wang Z, Xie Z*, Zi Y*, Yu X*, “Skin-integrated graphene embedded lead Zirconate Titanate rubber for energy harvesting and mechanical sensing,” Advanced Materials Technologies, 4(12): 1900744, 2019.

[8]. Xie Z*, Ji B, and Huo Q, “Mechanics design of stretchable near field communication antenna with serpentine wires,” Journal of Applied Mechanics-Transactions of the ASME, 85(4): 045001, 2018.

[9]. Gutruf P, Krishnamurthi V, Vázquez-Guardado A, Xie Z, Banks A, Su C, Xu Y, Haney C, Waters E, Kandela I, Krishnan S, Ray T, Leshock J, Huang Y, Chanda D, and Rogers JA*, “Fully implantable optoelectronic systems for battery-free, multimodal operation in neuroscience research,” Nature Electronics, 1(12): 652-660, 2018. (Cover feature article)

[10]. Kim B#, Lee J#, Won S#, Xie Z#, Chang J, Yu Y, Cho Y, Jang H, Jeong J, Lee Y, Ryu A, Kim D, Lee K, Lee J, Liu F, Wang X, Huo Q, Min S, Wu D, Ji B, Banks A, Kim J, Oh N, Jin H, Han S, Kang D, Lee C, Song Y, Zhang Y, Huang Y, Jang K*, and Rogers JA*, “Three-dimensional silicon electronic systems fabricated by compressive buckling process,” ACS Nano, 12(5): 4164–4171, 2018.

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