刘冬

个人信息Personal Information

副教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

学科:机械电子工程. 机械制造及其自动化. 机械设计及理论

办公地点:机械学院6116

电子邮箱:liud@dlut.edu.cn

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Development of a Distributed Bernoulli Gripper for Ultra-thin Wafer Handling

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论文类型:会议论文

发表时间:2017-01-01

收录刊物:Scopus、EI、CPCI-S

卷号:0

页面范围:265-270

摘要:Ultra-thin wafer (thickness < 100 mu m) gripper is a challenging component to design since the wafer is one of the thinnest and fragile materials. In this paper, a soft acting non-contact gripper based on the distributed Bernoulli principle for ultra-thin wafer is developed and evaluated. The theoretical analysis and experimental studies of the designed gripper are carried out. The effects of the two key operation parameters: air flow rate and gap height (between the gripper and the wafer) on the gripper performance are investigated. From the experimental results, the appropriate parameters can be recommended. Finally, a performance comparison among the designed gripper and two existing grippers is studied, which shows that the designed gripper can provide a more gentle lifting force.