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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
学科:机械电子工程. 机械制造及其自动化. 机械设计及理论
办公地点:机械学院6116
电子邮箱:liud@dlut.edu.cn
Development of a Distributed Bernoulli Gripper for Ultra-thin Wafer Handling
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论文类型:会议论文
发表时间:2017-01-01
收录刊物:Scopus、EI、CPCI-S
卷号:0
页面范围:265-270
摘要:Ultra-thin wafer (thickness < 100 mu m) gripper is a challenging component to design since the wafer is one of the thinnest and fragile materials. In this paper, a soft acting non-contact gripper based on the distributed Bernoulli principle for ultra-thin wafer is developed and evaluated. The theoretical analysis and experimental studies of the designed gripper are carried out. The effects of the two key operation parameters: air flow rate and gap height (between the gripper and the wafer) on the gripper performance are investigated. From the experimental results, the appropriate parameters can be recommended. Finally, a performance comparison among the designed gripper and two existing grippers is studied, which shows that the designed gripper can provide a more gentle lifting force.