zhuxianglong
Gender:Male
Alma Mater:大连理工大学
Paper Publications
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Yang, Mingwei, zhuxianglong, Renke Kang, Jiao, Zhenhua, Dongming Guo, Dong Zhigang.Development of the measurement-grinding integrated machine tool[A],ISAAT 2017 - Proceedings of the 20th International Symposium on Advances in Abrasive Technology,2022,458-464
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zhuxianglong, Renke Kang, wangyanshai, Dongming Guo.Development of three-dimensional dynamometer for wafer grinder[J],Advanced materials research,2022,126-128:361-366
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zhuxianglong, Dong Zhigang, Renke Kang, Dongming Guo.Development of ultra-precision grinder for 300mm wafers[J],Advanced materials research,2022,565:609-614
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李崎岩, zhuxianglong, Dong Zhigang, Sophie, Renke Kang.Deviation analysis of wall thickness measurement for tube parts with large depth to diameter rati...[A],The 21st International Symposium on Advances in Abrasive Technology,2022
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Pan, Bo, Renke Kang, Fu, Haiyang, zhuxianglong, Harry.Double-sided lapping of thin copper substrate by textured fixed-abrasive pad[A],19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019,2022,432-435
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Yao, Weihua, Renke Kang, Maggie Guo, zhuxianglong.Effect of grinding residual height on the surface shape of ground wafer[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,299
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莫宇博, zhuxianglong, Dong Zhigang, Renke Kang, daihengzhen, 李琦岩.Error analysis and Device Improvement for Measuring Straightness of Deep Hole Based on Photoelect...[A],The 22nd International Symposium on Advances in Abrasive Technology,2022,1-7
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Dong Zhigang, zhuxianglong, Renke Kang.Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding ...[A],Advanced materials research,2022,797:597-602
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Dong Zhigang, Zhao, X.W., zhuxianglong, Renke Kang, Hao, B.J..Experimental investigation on grinding performance of microcrystalline alumina abrasive grinding ...[J],Advanced materials research,2022,797:597-602
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zhuxianglong, yuli, Dong Zhigang, Renke Kang, Shang GAO, Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206