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Reduced curing kinetic energy and enhanced thermal resistance of phthalonitrile resins modified with inorganic particles
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论文类型: 期刊论文
发表时间: 2018-07-01
发表刊物: POLYMERS FOR ADVANCED TECHNOLOGIES
收录刊物: SCIE
卷号: 29
期号: 7
页面范围: 1922-1929
ISSN号: 1042-7147
关键字: curing kinetics; heat resistance; inorganic particles; phthalonitrile
摘要: The effects of inorganic particles such as Al2O3 and B4C on the solidification kinetics and heat resistance of phthalonitrile resin were investigated. The properties of the blends and the cured products were tested by rheometer, differential scanning calorimetry, Fourier transform infrared spectroscopy, and thermogravimetric analysis. The results revealed that B4C and Al2O3 inorganic particles could prolong the gel time of phthalonitrile resin and broaden the processing window. The curing kinetic analysis showed that the presence of the particles could significantly reduce the curing activation energy of phthalonitrile resins by 72.38kJ/mol down to 43.03kJ/mol. Meanwhile, the heat resistance of the phthalonitrile resin was improved. Among them, the blend system combined with 30% B4C showed prominent thermoresistance. And while the T-d5% weight loss temperature was 600 degrees C, char yield at 1000 degrees C was higher than 86% under nitrogen atmosphere; while the T-d5% weight loss temperature was 581 degrees C, char yield at 1000 degrees C was higher than 80% under air atmosphere. Hence, the resulting resins were good candidate matrix of high-temperature structural composites.

蹇锡高

教授   博士生导师   硕士生导师

性别: 男

毕业院校:大连工学院

学位: 硕士

所在单位:化工学院

学科:高分子材料. 高分子化学与物理. 膜科学与技术

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