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论文类型：期刊论文

发表时间：2010-11-01

发表刊物：APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

收录刊物：SCIE、EI、Scopus

卷号：101

期号：3,SI

页面范围：517-521

ISSN号：0947-8396

摘要：Based on the requirements for silicon sheets with different thickness in MEMS, and according to the experimental results, the element of the temperature distribution was investigated by calculation with ANSYS, and the bending mechanism of different thicknesses of the silicon sheet is proposed. The results showed that the plastic deformation was delayed as the thickness is increased. The bending angle was bigger with the increment being smaller as the scanning numbers increased, and the biggest bending angle was obtained finally.