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Dongming Guo
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[351]王续跃, 康仁科, 徐文骥, 郭东明.Laser Cleaning of Fine Particles on Si-Wafer[A],2010
[352]孙玉文, 冯西友, 郭东明.一类卷曲模型的B样条曲面建模方法[J],机械工程学报,2010,3:125-130
[353]Zhang, Zhenyu, Meng, Yaowu, Guo, Dongming, Wu, Lailei, Tian, Yongjun, Liu, Riping, ZY (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Material removal mechanism of precision grinding of soft-brittle CdZnTe wafers[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2010,46(5-8):563-569
[354]Gao, Hang, Wang, Biling, Guo, Dongming, Li, Yuzhuo, H (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Experimental Study on Abrasive-Free Polishing for KDP Crystal[J],JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2010,157(9):II853-II856
[355]吴东江, 郭东明.Study of weld morphology on thin Hastelloy C-276 sheet of pulsed laser welding[J],Physics Procedia,2010,5(11):99-105
[356]王续跃, 康仁科, 徐文骥, 郭东明.Laser Precision Cutting of Slot Antenna Array Based on Vapor-melt Ratio Controlled[A],2010
[357]Wang, X. Y., Kang, R. K., Xu, W. J., Guo, D. M., J..Laser Cleaning of Fine Particles on Si-Wafers[A],2010,1315:1588-+
[358]李庆忠, 康仁科, 郭东明.微电子和光电子制造中的节约型高效精密加工技术[J],江南大学学报(自然科学版),2009,8(6):746-752
[359]Sun, Yuwen, Ren, Fei, Guo, Dongming, Jia, Zhenyuan, YW (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Estimation and experimental validation of cutting forces in ball-end milling of sculptured surf...[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2009,49(15):1238-1244
[360]张春波, 郭东明, 盛贤君, 柳敏静, 孙玉文, 雷明凯, Zhang, C.-B.(zhangcb@2911.net).平面波谱-表面积分法的快速算法[J],大连理工大学学报,2009,49(6):854-857
total751 36/76
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