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Dongming Guo
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[491]Guo, D., Liu, M., Sheng, X., Sun, Y., Zhang, C..Determination of the scheme of the precision grinding compensation on the radome[J],Frontiers of Mechanical Engineering in China,2007,2(3):263-266
[492]Huo, F.W., Jin, Z.J., Zhao, F.L., Kang, R.K., Guo, D.M., F.W.(huofengwei@sohu.com).Experimental investigation of brittle to ductile transition of single crystal silicon by single g...[J],Key Engineering Materials,2007,329:433-438
[493]Guo, D.M., Zhang, C.B., Kang, R.K., Sun, Y.W., D.M.(guodm@dlut.edu.cn).Inverse method for determining grinding area and material removal amount in grinding radome[J],Key Engineering Materials,2007,329:81-86
[494]Huo, F. W., Jin, Z. J., Kang, R. K., Guo, D. M..A method for grinding mode identification in grinding of silicon wafers[A],2007,24-25:255-260
[495]Sun, Yu-Wen, Guo, Dong-Ming, Jia, Zhen-Yuan, YW (reprint author), Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China..Spiral cutting operation strategy for machining of sculptured surfaces by conformal map approac...[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2006,180(1-3):74-82
[496]徐道明, 贾振元, 郭东明, Xu, D.-M..理想材料零件实体模型自动添加支撑技术研究[J],大连理工大学学报,2006,46(6):837-844
[497]霍凤伟, 康仁科, 赵福令, 金洙吉, 郭东明.硅片纳米磨削过程中磨粒切削深度的测量[J],金刚石与磨料磨具工程,2006,5:69-73
[498]Sun, Yuhui, Kang, Renke, Guo, Dongming.Modeling of back pressure distribution on the wafer loaded in a multi-zone carrier in chemical ...[A],2006,532-533:233-+
[499]Ren, Li, Guo, Dongming, Yang, Rui, Jia, Zhenyuan.Optimization design of heterogeneous mold based on genetic algorithm[A],2006,532-533:825-+
[500]Guo, Dongming, Zhang, Min, Jin, Zhuji, Kang, Renke, M (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining, Dalian 116023, Peoples R China..Effects of chloride ion on the texture of copper and Cu-ZrB2 coatings electrodeposited from cop...[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2006,22(5):643-646
total751 50/76
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