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一种高强导电Cu-Ni-Si-M合金

Release Time:2022-10-20  Hits:

First Author: 王清

Disigner of the Invention: 董闯,李冬梅,Wenlong Zhou,李廷举,王同敏

Institution: 材料科学与工程学院

Application Number: CN103205600A

Authorization Number: CN201310136638.3

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