Hits:
First Author:YOU Hongxin
Disigner of the Invention:胡军,liurunjie,韩冰,zhouyihui,戴行涛,古海波
Application Number:CN201110281928.8
Authorization Date:2011-09-21
Authorization number:CN102374954A
Pre One:压力容器气密性实验装置及方法
Next One:一种Ni-Cu包覆电解质材料的制备方法