NAME

YOU Hongxin

Patents

一种Ni-Cu包覆电解质材料的制备方法
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  • First Author:

    YOU Hongxin

  • Disigner of the Invention:

    曹磊,曲斌,liurunjie

  • Application Number:

    CN201310262984.6

  • Authorization Date:

    2013-06-27

  • Authorization number:

    CN103367783A

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