Hits:
First Author:YOU Hongxin
Disigner of the Invention:wangtonghua,Lin Li,王春雷,liurunjie
Application Number:CN201410509641.X
Authorization Date:2014-09-28
Authorization number:CN104385643A
Pre One:一种Ni-Cu包覆电解质材料的制备方法
Next One:低温容器多性能试验装置与试验方法