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Indexed by:会议论文

Date of Publication:2012-01-01

Included Journals:CPCI-S、Scopus

Volume:1430

Issue:31

Page Number:1072-1079

Key Words:Void; Morphology; Ultrasonic Scattering Attenuation; Random Void Model

Abstract:A 2D random void model (RVM) is proposed to describe voids morphology in Carbon Fiber Reinforced Plastic (CFRP) composite materials and used to investigate Ultrasonic Scattering Attenuation Coefficient (USAC). Void morphology simulations from RVM present good matches to micrographic observations. The fluctuations of USAC due to the randomness of void morphology and their dependence on the frequency have been discussed, which are significantly helpful to clarify ultrasonic scattering attenuation mechanism from voids in nature.