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陈军

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Associate Professor Supervisor of Master's Candidates

Scientific Research

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路福叶, 孙晗, Yang, Wenlong, Zhou, Tianshuo, wangyunpeng, Ma Haoran, mahaitao, chenjun.Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.[J],Materials (Basel, Switzerland),2024,17(21)
chenjun, 未剑豪, 李伟, haoshengzhi, wangyinong.强流脉冲电子束改性对45钢耐磨性能的影响[J],中国表面工程,2024
赏敏, 陈祥序, 赵元邦, 柯景栗, Li, Chenyu, Wang, Yanchen, wangyunpeng, mahaitao, chenjun.IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase[J],Journal of Materials Research and Technology,2024,33:6307-6318
chenjun, 未剑豪, 李伟, haoshengzhi, wangyinong.强流脉冲电子束改性对45 钢耐磨性能的影响[J],中国表面工程,2024,1-10
chenjun, 李伟, haoshengzhi.高能束表面改性技术在航空领域的应用[J],航空制造技术,2024,67(4):32-43
姚金冶, 郭世浩, 王立, 赏敏, 陈祥序, Ma Haoran, wangyunpeng, chenjun, mahaitao.First-Principles Study of Ni Additions on Mechanical Properties of Η'-Cu6sn5-Based Intermetallic Compounds[J],SSRN,2024

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