Release Time:2024-11-20  Hits:

Date of Publication: 2024-11-16

Journal: Journal of Materials Research and Technology

Volume: 33

Page Number: 6307-6318

ISSN: 2238-7854

Key Words: Bi phase coarsening; Bismuth alloys; Calcium alloys; Coarsening process; Cooling rates; Copper alloys; Four interfacial reaction mechanism; Mechanism of IMC growth and evolution; Phase coarsening; Reaction mechanism; Sn58bi solder; Soldered joints; Soldering; Soldering alloys; Solder joints; Surface reactions; Tin alloys