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Date of Publication:2024-11-16

Journal:Journal of Materials Research and Technology

Volume:33

Page Number:6307-6318

ISSN No.:2238-7854

Key Words:Bi phase coarsening; Bismuth alloys; Calcium alloys; Coarsening process; Cooling rates; Copper alloys; Four interfacial reaction mechanism; Mechanism of IMC growth and evolution; Phase coarsening; Reaction mechanism; Sn58bi solder; Soldered joints; Soldering; Soldering alloys; Solder joints; Surface reactions; Tin alloys