IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase
Release Time:2024-11-20 Hits:
Indexed by: Journal Papers
Document Code: 412284
Date of Publication: 2024-11-10
Journal: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume: 33
Page Number: 6307-6318
ISSN: 2238-7854
Key Words: INTERFACE; LEAD-FREE; MICROSTRUCTURE; RELIABILITY; SN