Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination.
Release Time:2024-11-25 Hits:
Date of Publication: 2024-11-21
Journal: Materials (Basel, Switzerland)
Volume: 17
Issue: 21
ISSN: 1996-1944
Key Words: corrosion; dendrite; electrochemical migration; Sn-58Bi solder