Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination
Release Time:2024-11-25 Hits:
Indexed by: Journal Papers
Document Code: 412624
Date of Publication: 2024-11-10
Journal: MATERIALS
Volume: 17
Issue: 21
Key Words: CORROSION; HUMIDITY; MECHANISM; NACL; PRINTED-CIRCUIT BOARD; SN SOLDER; SURFACE FINISH; TEMPERATURE; TIN