Hits:
Indexed by:Journal Papers
Date of Publication:2017-01-01
Journal:Acoustical Physics
Volume:63
Issue:4
Page Number:490-495
Pre One:In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage
Next One:Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage