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Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during multiple reflows

Release Time:2022-06-10  Hits:

Date of Publication: 2018-01-01

Journal: JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS

Institution: 材料科学与工程学院

Volume: 29

Issue: 1

Page Number: 602-613

ISSN: 0957-4522

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