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Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during multiple reflows

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Date of Publication:2018-01-01

Journal:JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS

Affiliation of Author(s):材料科学与工程学院

Volume:29

Issue:1

Page Number:602-613

ISSN No.:0957-4522

Pre One:Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

Next One:Temperature-induced effect and control of Cu3Sn on the rotation of orientation-preferred Cu6Sn5 crystals at Sn-3.0Ag/(001)Cu interface
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